We offer a wide array of PCB fabrication capabilities.

Design and Test:

2 mil Trace Width
3 mil Air Gap
IPC Class 2 / IPC Class 3
Flying Probe Net List Test
Differential Impedance
TDR Testing
Automatic Optical Inspection

Lamination:

1 to 30 Layers
Vacuum Lamination
Sequential Lamination

Plating:

Conductive Via Fill
Non-Conductive Via Fill
Plated Edges
Plated Radii (Castellation)
Plated Milling Cutouts
Hard Gold Body
Soft Bondable Gold
Immersion Gold
Immersion Silver
HASL Standard
HASL Lead Free (ROHS)
Entek (OSP)

Drill and Route:

Counter Sinks / Counter Bores
Scoring / Rout & Retain
Laser Route
Blind Vias / Buried Vias
Stacked Vias

Materials:

Flex and Rigid Flex

KaptonTM & Non KaptonTM

RF and High Speed Materials

FR4

High Tg / Rogers

Mix Materials / FR-4-Teflon

Metal Back Boards (LED/Power Distribution)

Heavy Cu 6 oz Finish Rigid and Rigid / Flex