
SEC:MECHANICAL // MFG:CALPAK-USA
SYSTEM DESIGN
End-to-end systems engineering that unifies electronics, software, and mechanical design into a single integrated product architecture.
Full System
Architecture Design
40+ Years
Engineering Depth
Multi-Discipline
Integrated Approach
V&V Ready
Requirements Verified
Why Engineers Trust Calpak
The Big Picture, Down to Every Detail
Complex products fail when disciplines work in isolation. Calpak USA's system design practice starts at the top level — defining how electronics, firmware, software, and mechanical subsystems work together as a single, cohesive product architecture.
"A circuit board that works on the bench is not a product. A product is every subsystem — power, thermal, mechanical, firmware — designed to work together from day one."
We begin every system design engagement with requirements capture and decomposition — translating your operational needs into measurable specifications that flow down to each engineering discipline. Interface definitions, power budgets, thermal envelopes, and communication protocols are established early, preventing the costly integration surprises that derail programs built by fragmented teams.
Because Calpak designs and manufactures under one roof, our system engineers work side-by-side with the circuit designers, firmware developers, and mechanical engineers who will implement each subsystem. This means trade studies happen with real manufacturing data, interface conflicts are caught at the whiteboard — not the prototype bench — and verification plans are baked in from the start.
What We Do
System Design & Engineering Services
Top-down engineering that turns operational requirements into a fully defined, manufacturable product architecture.
System Architecture
Top-level block diagrams and functional allocation that define how every subsystem connects — power distribution, data flow, control hierarchy, and physical packaging in a single, unified architecture.
Requirements Engineering
Structured requirements capture, decomposition, and traceability from top-level operational needs down to component-level specifications — ensuring nothing is lost between customer intent and engineering execution.
Interface Definition
Formal interface control documents that define every connection between subsystems — connectors, protocols, voltage levels, mechanical mating surfaces, and data formats — locked down before detailed design begins.
Trade Studies & Analysis
Data-driven trade-off analysis across competing design approaches — evaluating cost, weight, power, thermal performance, and manufacturing complexity to identify the optimal solution before committing to detailed design.
Verification & Validation
Comprehensive V&V planning from day one — defining test methods, acceptance criteria, and inspection points at every level of assembly so the path from prototype to qualified product is clear and documented.
Integration Management
Hands-on subsystem integration and risk management — coordinating hardware, firmware, and mechanical bring-up into a single integration plan that catches conflicts early and keeps your program on schedule.
Quality Assurance
Certifications & Compliance
Every system is architected and documented under aerospace and defense-grade quality standards.
Common Questions
Frequently Asked Questions
What CAD tools does Calpak USA use for mechanical system design (SolidWorks, CATIA)?
Calpak USA's mechanical engineering team uses SolidWorks for detailed solid modeling, assembly design, and drawing generation, along with CATIA for complex surface modeling and large-assembly management required by aerospace and defense programs. Our engineers leverage SolidWorks Simulation for linear static and thermal analysis, SolidWorks Flow Simulation for internal and external airflow studies, and SolidWorks PDM for version-controlled design data management across multi-engineer projects. For programs requiring CATIA compatibility, Calpak USA maintains full associativity with customer-furnished CATIA models to ensure seamless data exchange. All CAD environments at our Hawthorne, California facility are integrated with our schematic capture and PCB layout tools through STEP and IDF file exchanges, enabling mechanical engineers to import accurate board outlines, component heights, and connector locations directly into enclosure and chassis assemblies for precise electromechanical fit verification.
How does Calpak USA approach thermal management for high-power electronics enclosures?
Calpak USA performs computational fluid dynamics and finite element thermal analysis early in the system design phase to map heat dissipation paths and identify thermal bottlenecks before physical prototypes are built. Our engineers design thermal management solutions including custom extruded and machined aluminum heat sinks, heat pipe assemblies, forced-air cooling with fan curve matching, liquid cold plate interfaces, and thermally conductive gap pads and interface materials. Calpak USA models component junction temperatures under worst-case operating conditions using manufacturer-published thermal resistance data and validated boundary conditions. For sealed enclosures that cannot use forced convection, our team designs conduction-cooled architectures with optimized fin geometry and chassis contact surfaces. All thermal designs developed at our Hawthorne, California facility are validated against AS9100 documentation requirements with thermal test reports comparing simulated predictions to measured prototype temperatures under representative power loading.
Can Calpak USA design mechanical systems that integrate with your existing electronics?
Calpak USA routinely designs mechanical systems around customer-furnished PCBAs, cable assemblies, and electronic subsystems. Our engineers import your board data via STEP, IDF, or ODB++ formats to create accurate 3D models that account for component keep-out zones, connector mating heights, cable bend radii, and airflow clearances. Calpak USA coordinates directly with your electronics team on mounting hole patterns, standoff heights, thermal interface requirements, EMI shielding provisions, and grounding strategies. When modification to existing electronics would improve the overall system, our in-house PCB design team can propose targeted board layout changes that enhance mechanical integration without requiring a full electrical redesign. All integration work at our Hawthorne, California facility follows formal interface control document processes under our AS9100 quality system to ensure mechanical and electronic design changes are tracked and coordinated across disciplines.
What DFM considerations does Calpak USA apply during the mechanical design phase?
Calpak USA integrates Design for Manufacturability analysis throughout every mechanical design phase, starting from concept selection through detailed drawing release. Our engineers apply DFM principles specific to each target process including CNC machining, sheet metal fabrication, injection molding, die casting, and additive manufacturing. Calpak USA evaluates wall thicknesses, draft angles, undercut features, tolerance stackups using GD&T per ASME Y14.5, and surface finish callouts relative to functional and cosmetic requirements. We minimize unique fastener types, design self-locating features to reduce fixturing complexity, and specify standard commercial hardware wherever possible. For injection-molded parts, Calpak USA performs mold flow analysis to predict fill patterns, weld lines, and sink marks before tool commitments. Our Hawthorne, California facility maintains relationships with vetted domestic and international fabrication partners, and our engineers optimize designs for specific vendor capabilities to reduce cost and lead time.
Does Calpak USA provide FEA simulation and structural analysis for mechanical designs?
Calpak USA performs finite element analysis for structural, thermal, and vibration loading using SolidWorks Simulation and ANSYS Mechanical to validate designs before prototyping and production tooling commitments. Our structural analyses cover linear static stress and deflection under operational loads, modal frequency extraction to avoid resonance with known excitation sources, random vibration power spectral density analysis per MIL-STD-810 and ASTM standards, and fatigue life prediction for cyclic loading applications. Calpak USA engineers build accurate material models using tested property data for metals, plastics, and composites, apply realistic boundary conditions derived from system-level interface loads, and converge mesh refinement studies to ensure result accuracy. All FEA reports generated at our Hawthorne, California facility include model descriptions, loading assumptions, mesh convergence evidence, safety margin summaries, and design recommendations traceable to your project requirements under our AS9100 quality system.
Explore More
Related Services
Machine Design
Custom automated assembly equipment, fixtures, and production tooling.
Enclosure & Box Build
Complete enclosure fabrication and electromechanical box build assembly.
Aerospace
Mission-critical electronics for aerospace applications with AS9100 certification.
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