
SEC:ELECTRONIC-ASSEMBLIES // MFG:CALPAK-USA
PRODUCTION ASSEMBLY
High-volume printed circuit board assembly up to 10,000,000+ units with uncompromising reliability.
40+ Years
Assembly Experience
Up to 10M
Unit Capacity
ISO 9001
Quality Certified
Full Traceability
Design to Delivery
Why Manufacturers Trust Calpak
Scaled for Volume
If your business requires high-volume printed circuit board assembly, Calpak delivers complete turnkey solutions ideally suited for bulk PCB assembly orders. Our equipment, assembly line process, and quality control provide the capability of high-volume PCB assembly up to 10,000,000 units.
"From design consultation to final delivery — every board built with precision at scale."
We are the perfect source for large-order PCB assembly on a budget. Due to our high level of efficiency and more than 40 years of experience with printed circuit board manufacturing and assembly, we offer large orders at surprisingly competitive prices.
Our production process follows a tested and practiced workflow from pre-order consultation with veteran engineers to fabrication, component procurement, assembly, testing, inspection, and shipping — all managed by a highly-skilled production staff. No matter how many boards you order, you will enjoy fast service, low prices, and extremely high quality.
What We Do
Production-Scale Assembly Capabilities
Complete turnkey PCB assembly services for high-volume production runs with unmatched efficiency.
High-Volume SMT
High-speed surface mount assembly for production runs up to 10 million units with automated pick-and-place precision.
Through-Hole Assembly
Manual and automated through-hole insertion for power and connector components in high-volume production.
Mixed Technology
Combined SMT and through-hole assembly on complex multi-technology boards with seamless workflow integration.
Quality Inspection
AOI, X-ray, and visual inspection at every stage of the assembly process to ensure zero-defect production.
Testing & Validation
ICT, functional testing, burn-in, and flying probe for complete electrical verification of every unit.
Packaging & Shipping
ESD-safe packaging, labeling, and logistics management for global delivery with full traceability.
Quality Assurance
Certifications & Compliance
Every production assembly project is backed by industry-leading quality standards and certifications.
Common Questions
Frequently Asked Questions
What is the minimum order quantity for production PCB assembly at Calpak USA?
Calpak USA does not impose a rigid minimum order quantity for production PCB assembly. While our high-speed SMT lines are optimized for runs of 100 units and above, we routinely handle orders ranging from low hundreds to over 10 million units per year. Smaller production lots are priced to reflect setup amortization across fewer boards, so unit cost decreases as volume increases. For quantities under 100, our prototype assembly service is typically more cost-effective. Calpak USA recommends discussing your annual volume forecast with our Hawthorne, California team early in the quoting process so we can structure pricing tiers, blanket order schedules, and inventory stocking agreements that minimize per-unit cost while maintaining AS9100 Rev. D traceability and IPC Class 2 or Class 3 workmanship across every board delivered.
What are the primary cost drivers for high-volume PCB assembly?
The largest cost drivers in high-volume PCB assembly are component procurement, bare board fabrication, and test development. Component cost typically accounts for 60 to 75 percent of the total assembly price, making BOM optimization critical. Board complexity also matters: higher layer counts, tighter trace and space requirements, and advanced surface finishes increase fabrication cost. On the assembly side, double-sided reflow, fine-pitch BGAs requiring X-ray inspection, and selective soldering for mixed-technology boards add processing steps. Test fixture development (ICT or functional test) carries a one-time NRE charge that amortizes over the production run. Calpak USA provides detailed cost breakdowns in every quote from our Hawthorne, California facility, and our engineers can suggest BOM alternates, panelization strategies, and test approaches that reduce total landed cost without compromising quality or IPC compliance.
Does Calpak USA provide automated optical inspection and X-ray for BGA components?
Yes. Calpak USA performs automated optical inspection on every production board to verify solder joint quality, component presence, polarity, and alignment against golden-board reference data. For ball grid array and bottom-terminated components where solder joints are hidden beneath the package, Calpak USA uses X-ray inspection to evaluate solder ball formation, detect bridging, assess voiding percentages, and confirm proper collapse. Our X-ray system provides 2D and oblique-angle imaging with sufficient resolution to inspect 0.4 mm pitch micro-BGAs. For high-reliability programs requiring IPC Class 3 workmanship, Calpak USA documents voiding percentages per IPC-7095 criteria. These inspection capabilities are standard on our production lines in Hawthorne, California, and inspection data is archived with full lot traceability under our AS9100 Rev. D quality management system.
How does Calpak USA manage the transition from prototype to full production assembly?
Calpak USA manages prototype-to-production transitions through a structured process that preserves all engineering knowledge accumulated during prototyping. When your design is validated, our production engineering team reviews the prototype build records, DFM findings, and any ECOs incorporated during evaluation. We then develop or refine solder paste stencils, program pick-and-place machines from the prototype placement data, and design or update test fixtures for ICT or functional testing. First article inspection is performed on the initial production lot per AS9100 Rev. D requirements, and results are documented before full-rate production begins. Because Calpak USA runs both prototype and production in our single Hawthorne, California facility, tooling and process documentation transfer seamlessly without vendor requalification. This approach typically saves two to four weeks compared to transitioning between separate prototype and production houses.
What happens to leftover components after a production run is completed?
Calpak USA tracks all issued components against the BOM quantity and documents any attrition, rejects, or unused material at the close of each production lot. For turnkey orders where Calpak USA procured the components, excess inventory is held in our Hawthorne, California warehouse under your account for up to 90 days at no charge, available for future builds or engineering use. After 90 days, Calpak USA contacts your procurement team to arrange return shipment, extended storage, or authorized disposition. For consigned orders where you supplied the components, all unused material is returned with the finished assemblies unless you request Calpak USA to hold stock for scheduled follow-on lots. Component traceability, including lot codes and date codes, is maintained throughout storage per our AS9100 Rev. D and ISO 9001 quality management system.
What is Calpak USA's standard lead time for production PCB assembly, and can it be expedited?
Standard production lead times at Calpak USA range from 3 to 6 weeks depending on order volume, board complexity, and component availability. This includes incoming inspection, SMT and through-hole assembly, testing, final quality inspection, and packaging. The longest variable is typically component procurement, which Calpak USA mitigates through long-lead-item pre-ordering and safety stock agreements for repeat production programs. Expedited production is available for time-critical orders, with accelerated schedules as short as 5 to 10 business days when components are in stock or consigned. Expedited orders are prioritized on our production lines with dedicated scheduling and carry a premium that varies by the degree of acceleration. Contact our Hawthorne, California production team with your BOM and target delivery date for a firm lead-time commitment and any applicable expedite pricing.
Explore More
Related Services
Prototype Assembly
Rapid prototype PCB assembly for design validation and testing.
Turn-Key Assembly
Complete turn-key PCB assembly with component sourcing and logistics management.
PCB Fabrication
Prototype and production PCB fabrication with quick-turn and volume capabilities.
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