|Our printed circuit board assembly and manufacturing capability is specifically targeted for the development of high-mix boards in low-to-medium volumes for the defense and aerospace industries.Operator training, certifications, equipment selection, and process development are targeted to achieve the versatility necessary to produce experimental prototypes, pre-production orders and full production.We offer a comprehensive array of services, including:
- IPC 610 Class 3 assembly
- Design, test and assembly
- Circuit board schematic and layout design
- Component selection
- Combination surface mount (SMT) and chip-on-board (COB) MADE IN USA
- Turn-key product assembly
Our experienced in-house design and manufacturing engineering team can support build-to- print or design-to-specification projects through the use of well-defined and documented processes which alleviate production concerns and enhance reliability.
Calpak USA meets your specific requirements for low-to-high volume military circuit card assembly in our AS9100 & ISO 9001 certified manufacturing facility.